High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate
The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.
This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.
- Company：モリマーエスエスピー 本社
- Price：Other
